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PI covering Film (PI Hot pressing film)

PI covering film (PI hot pressing film) is made of polyimide film coated with high-performance thermosetting epoxy resin adhesive, with release film or release paper as the isolation layer, after high temperature curing to form an insulating heat-resistant covering film. The product has excellent softness, high temperature resistance, insulation and other properties. Suitable for new energy, LED and other products, such as PI heating film, CCS, automotive taillight, backlight, light strip, FPC wiring, etc

Product Specification

Item

Test method

Specification

Width

 Specification

500/255/250±1mm

PI   thickness

 Specification

12.5um、25um、50um

Adhesive   thickness

 Specification

13um–40um

Shelf   life

<10℃,<65%RH

3months

23℃±3℃,<65%RH

15days

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